Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-04-01
1999-12-28
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
361795, 257668, 257642, 174255, H01K 310
Patent
active
060064285
ABSTRACT:
The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.
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Feilchenfeld Natalie Barbara
Kresge John Steven
Moore Scott Preston
Nowak Ronald Peter
Wilson James Warren
Fraley Lawrence R.
International Business Machines - Corporation
Smith Sean
Young Lee
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