Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1986-10-07
1988-05-03
Anderson, Harold D.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524606, 525432, 528338, 528339, 528340, 528342, C08L 7710, C08L 7708
Patent
active
047421100
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a polyamide composition which is excellent in all of heat-resistant characteristics, mechanical characteristics, chemical and physical characteristics and molding characteristics.
Background Art
Thermoplastic resins such as polyolefins, polyesters and polyamides can be molded by melt molding such as compression molding, injection molding or extrusion molding and are excellent in the moldability, but they are not satisfactory as engineering plastics in heat-resistant characteristics, mechanical characterisitics and chemical characteristics. Therefore, these thermoplastic resins are used as general-purpose molding resins while utilizing excellent characteristics thereof.
As conventional engineering plastics excellent in heat-resistant characteristics, mechanical characteristics and chemical and physical characteristics, there are known polytetrafluoroethylene (Teflon .RTM.), poly-p-phenyleneterephthalamide (Kebler.RTM.), a polyimide composed of a condensate of 4,4'-diaminodiphenyl ether and pyromellitic anhydride (Kapton.RTM.), polyhexamethyleneadipamide (6,6-nylon), ,4-trimethylhexamethyleneterephthalamide (Trogamid.RTM.), polyphenylenesulfide and polyacetal. Of these plastics, polytetrafluoroethylene, polyterephthaloyl-p-phenylene-diamine and the above-mentioned polyimide resin are excellent in heat-resistant characteristics, mechanical characteristics and chemical and physical characteristics, but they are defective in that melt molding is impossible. Therefore, the application fields are considerably limited. Of the foregoing engineering plastics, polyphenylenesulfide, polyhexamethylene-adipamide (6,6-nylon), poly-2,2,4-trimethylhexamethylene-terephthalamide (Trogamid T.RTM.) and polyacetal are characterized in that melt molding is possible. However, polyphenylenesulfide is inferior in heat-resistant characteristics such as melting point, glass transition point and thermal distortion temperature and mechanical characteristics such as impact strength and abrasion resistance, and polyamides such as polyhexamethyleneadipamide (6,6-nylon) and poly-2,2,4-trimethylhexamethyleneterephthalamide (Trogamid T.RTM.) are inferior in heat-resistant characteristics such as glass transition point and thermal distortion temperature, mechanical characteristics such as tensile strength, flexural strength, critical PV value and abrasion resistance, and chemical and physical characteristics such as chemical resistance, boiling water resistance and saturated water absorption. Furthermore, polyacetal is inferior in heat-resistant characteristics such as melting point and thermal distortion temperature and mechanical characteristics such as flexural strength, impact strength and abrasion resistance.
DISCLOSURE OF THE INVENTION
It is therefore a primary object of the present invention to provide a polyamide composition which is excellent in molding characteristics such as melt flowability, melt compression moldability, melt injection moldability and melt extrusion moldability and is prominently improved in mechanical characteristics such as tensile strength, flexural strength and impact strength and thermal characteristics such as thermal distortion temperature and thermal aging resistance.
In accordance with the present invention, there is provided a polyamide composition having fractions which are insoluble and soluble, respectively, in concentrated H.sub.2 SO.sub.4 at 50.degree. C. comprising a polycondensate consisting of (a) 60 to 100 mole % of terephthalic acid component units and 40 to 0 mole % of units of an aromatic dicarboxylic acid component other than the terephthalic acid component and (b) units of an aliphatic alkylene-diamine component having 6 to 18 carbon atoms, wherein the gel proportion (Fg) defined by the following formula: Wg stands for the weight in grams of the fraction of the polyamide composition which is insoluble in concentrated sulfuric acid at 50.degree. C., sulfuric acid at 50.degree. C. has an intrinsic viscosity (.eta.) of at least 0.5 dl/g a
REFERENCES:
patent: 3081273 (1963-03-01), Caprio
patent: 3642710 (1972-02-01), Keen et al.
Ikeda Akio
Nishiwaki Kenichi
Sakashita Takeshi
Zenitani Yurimasa
Anderson Harold D.
Mitsui Petrochemical Industries Ltd.
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