Polystyrenic stretched film, process for producing said film, ph

Details Polystyrenic stretched film, process for producing said film, ph Polystyrenic stretched film, process for producing said film, ph

1996-07-29

1998-05-19

Nakarani, D. S.

Stock material or miscellaneous articles

Structurally defined web or sheet

Physical dimension specified

2642107, 2642358, 2642902, 428521, 428523, 428910, C08L 2504, C08L 2506, B29C 5514

Patent

active

057533547

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a polystyrenic stretched film, a process for producing said film, a photographic film, a process film for printing, and a film for over-head projectors. More particularly, the present invention relates to a polystyrenic stretched film which is advantageously used as various types of base material for films, such as base materials for condenser films, pressure-sensitive adhesive films, electric insulation films, packaging films, and the like, a process for producing said film, a photographic film, a process film for printing, and a film for over-head projectors.


BACKGROUND ART

Styrenic polymers having the syndiotactic configuration have excellent mechanical properties, heat resistance, appearance, solvent resistance, and electric properties, and are expected to be used in various applications. Therefore, various technologies for extrusion of films, sheets, and fibers, various molded articles, and various applications have been proposed.
In the field of films, a material is frequently used for practical applications in the form of laminates of various materials. Therefore, it is necessary that a material exhibits little deformation or strain by heating during the operation of lamination. Stretched films having various physical properties which use the styrenic polymers having the syndiotactic configuration described above as a material, processes for producing stretched films, and various applications using the stretched films have been disclosed in Japanese Patent Application Laid-Open No. 182348/1989, Japanese Patent Application Laid-Open No. 182346/1989, Japanese Patent Application Laid-Open No. 67328/1990, Japanese Patent Application Laid-Open No. 143851/1990, Japanese Patent Application Laid-Open No. 74437/1991, Japanese Patent Application Laid-Open No. 86707/1991, Japanese Patent Application Laid-Open No. 124750/1991, Japanese Patent Application Laid-Open No. 131843/1991, Japanese Patent Application Laid-Open No. 261485/1992, Japanese Patent Application Laid-Open No. 200858/1993, Japanese Patent Application Laid-Open No. 57013/1994, Japanese Patent Application Laid-Open No. 57014/1994, Japanese Patent Application Laid-Open No. 57015/1994, Japanese Patent Application Laid-Open No. 57016/1994, Japanese Patent Application Laid-Open No. 57017/1994, Japanese Patent Application Laid-Open No. 64036/1994, Japanese Patent Application Laid-Open No. 64037/1994, Japanese Patent Application Laid-Open No. 65399/1994, Japanese Patent Application Laid-Open No. 65400/1994, Japanese Patent Application Laid-Open No. 65401/1994, Japanese Patent Application Laid-Open No. 65402/1994, Japanese Patent Application Laid-Open No. 80793/1994, Japanese Patent Application Laid-Open No. 91748/1994, Japanese Patent Application Laid-Open No. 91749/1994, Japanese Patent Application Laid-Open No. 91750/1994, Japanese Patent Application Laid-Open No. 99485/1994, Japanese Patent Application Laid-Open No. 100711/1994, Japanese Patent Application Laid-Open No. 106616/1994, Japanese Patent Application Laid-Open No. 107812/1994, Japanese Patent Application Laid-Open No. 107813/1994, Japanese Patent Application Laid-Open No. 114924/1994, and Japanese Patent Application Laid-Open No. 114925/1994.
However, films of conventional styrenic polymers having the syndiotactic configuration sometimes show deformation such as warp, striation, waviness, and the like by heating the films even though the films have small degrees of heat shrinkage. In other words, the films do not have sufficient uniformity of thickness, and this causes problems when the films are used as various types of base material for films.


DISCLOSURE OF THE INVENTION

As the result of intensive studies made by the present inventors to solve the above problems, it has been found that the deformation by heating is formed by uneven distribution of the degree of heat shrinkage on the films, and the uneven distribution is more pronounced when the degree of heat shrinkage is large. It has also been found by the present inventors that th

REFERENCES:
patent: 5373031 (1994-12-01), Funaki et al.
patent: 5518817 (1996-05-01), Yamasaki et al.
Patent Abstracts of Japan, JP-A-6-87158, Mar. 29, 1994.
Patent Abstracts of Japan, JP-A-6-91748, Apr. 5, 1994.
Patent Abstracts of Japan, JP-A-6-91749, Apr. 5, 1994.

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