Polystyrenic resin composition and molded article thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

524282, 524291, 524398, 524413, C08J 521, C08J 536, C08J 310

Patent

active

060137096

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a polystyrenic resin composition and a molded article thereof. More particularly, the present invention relates to a polystyrenic resin composition which can advantageously be used as a material for industrial products, such as electric and electronic parts, industrial structural materials, automotive parts, electric appliances, and various types of mechanical parts, has excellent mechanical properties, heat resistance, chemical resistance, and property for molding, and is particularly excellent in resistance to heat aging; and a molded product thereof.


BACKGROUND ART

Heretofore, it has been disclosed in the specifications of Japanese Patent Application Laid-Open No. Showa 62(1987)-25795, Japanese Patent Application Laid-Open No. Heisei 1(1989)-279944, Japanese Patent Application Laid-Open No. Heisei 2(1990)-209938, Japanese Patent Application Laid-Open No. Heisei 2(1990)-219843, Japanese Patent Application Laid-Open No. Heisei 3(1991)-126744, and Japanese Patent Application Laid-Open No. Heisei 4(1992)-269893 that compositions having a good balance between strength, toughness, heat resistance, chemical resistance, and processability in molding can be obtained by melt blending a styrenic polymer having the syndiotactic configuration (hereinafter, occasionally referred to as SPS), a polyamide resin, and a compatibilizer for SPS and a polyamide as the main components of the compositions. By taking advantage of these excellent properties, practical application to products which require strength and heat resistance, such as electric and electronic parts, automobile parts, mechanical parts, and parts of industrial products, is under examination.
However, the above resin composition has a problem that the resistance to degradation by oxidation at a high temperature for a long time, i.e. the resistance to heat aging, is not sufficient although the resin compositions have the above excellent characteristics. Therefore, improvement in the resistance to heat aging for a long time has strongly been desired in order to increase reliability of the parts described above.
For solving the above problem, addition of a phenolic antioxidant (Japanese Patent Application Laid-Open No. Heisei 5(1993)-289290) and a combined use of a phenolic antioxidant and an antioxidant containing sulfur (Japanese Patent Application Laid-Open No. Heisei 6(1994)-384) have been proposed. However, sufficient increase in the resistance to heat aging is not achieved by these technologies. Addition of a combination of a copper compound and an iodine compound and addition of an amine antioxidant have also been proposed in order to increase the resistance to heat aging of a polyamide. Although the resistance to heat aging is increased to some extent by addition of these compounds, the obtained properties are not satisfactory. Moreover, the addition causes other problems that color of the molded products changes with time into yellow or brown, and that adverse effects of the copper compound arise to cause corrosion of extruders, molding machines, and the like.
On the other hand, a polyamide resin comprising a phenolic antioxidant and an antioxidant containing sulfur has been proposed. However, satisfactory results have not been obtained by using this technology, either.
Under the above circumstances, the present invention has an object of providing a polystyrenic resin composition which shows excellent resistance to heat aging so that decrease in physical properties or change in color are hardly caused even after exposure to a high temperature for a long time, has excellent toughness, rigidity, heat resistance, and chemical resistance, and can advantageously be used as a material for various types of industrial product.


DISCLOSURE OF THE INVENTION

As the result of extensive studies undertaken by the present inventors to develop a polystyrenic resin composition having the excellent resistance to heat aging as well as excellent toughness, rigidity, heat resistance, and chemical resistance, it was di

REFERENCES:
patent: 5089353 (1992-02-01), Negi et al.
patent: 5109068 (1992-04-01), Yamasaki et al.
patent: 5127158 (1992-07-01), Nakano
patent: 5166238 (1992-11-01), Nakano et al.
patent: 5200454 (1993-04-01), Nakano et al.
patent: 5219940 (1993-06-01), Nakano et al.
patent: 5270353 (1993-12-01), Nakano et al.
patent: 5326813 (1994-07-01), Okada et al.
patent: 5346950 (1994-09-01), Negi et al.
patent: 5352727 (1994-10-01), Okada
patent: 5391611 (1995-02-01), Funayama et al.
patent: 5391626 (1995-02-01), Machida et al.
patent: 5418275 (1995-05-01), Okada et al.
patent: 5436397 (1995-07-01), Okada
patent: 5444126 (1995-08-01), Okada et al.
patent: 5476899 (1995-12-01), Funaki et al.
patent: 5543462 (1996-08-01), Okada et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polystyrenic resin composition and molded article thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polystyrenic resin composition and molded article thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polystyrenic resin composition and molded article thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1462905

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.