Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including isolation structure
Reexamination Certificate
2006-08-15
2006-08-15
Dang, Trung (Department: 2823)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Including isolation structure
C438S370000, C257S588000, C257S592000, C257SE29044, C257SE29124
Reexamination Certificate
active
07091100
ABSTRACT:
In the inventive method of producing a base terminal structure for a bipolar transistor, an etch stop layer is applied on a single-crystal semiconductor substrate, a poly-crystal base terminal layer is produced on the etch stop layer and an emitter window is etched in the base terminal layer using the etch stop layer as an etch stop.
REFERENCES:
patent: 5010026 (1991-04-01), Gomi
patent: 5144403 (1992-09-01), Chiang et al.
patent: 5479047 (1995-12-01), Liao et al.
patent: 6403437 (2002-06-01), Chantre et al.
patent: 6440810 (2002-08-01), Johansson et al.
patent: 2001/0051413 (2001-12-01), Chantre et al.
patent: 2 805 924 (2001-09-01), None
patent: WO 98/57367 (1998-12-01), None
patent: WO 01/39264 (2001-05-01), None
Rudolph Uwe
Seck Martin
Tilke Armin
Dang Trung
Infineon - Technologies AG
Maginot Moore & Beck
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