Polyphenylene ether modified by reaction with cresol novolac...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Reexamination Certificate

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07439310

ABSTRACT:
The present invention can provide a resin composition comprising epoxy-modified polyphenylene ethers which show good solubility in MEK or acetone which has been conventionally used in a manufacturing process for printed boards of epoxy resins, and has high heat resistance originating from polyphenylene ethers. Specifically, the resin composition of the present invention contains (C) an epoxy-modified polyphenylene ether obtained by reacting (A) a polyphenylene ether having a content of volatile components of 0.1-5.0% by weight and a number of average molecular weight of 500 or more and less than 1.0×104and (B) a cresol-novolac type epoxy resin at a modification ratio of component (A) of 5-95%, wherein (B′) a cresol-novolac type epoxy resin is contained in an amount of 10-900 parts by weight based on 100 parts by weight of the total of the reaction products (C), and (A′) a polyphenylene ether.

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Kobunshi Ronbunshu, Japanese Journal of Polymer Science and Technology, vol. 51, No. 7, pp. 479-486, (Jul. 1994).
U.S. Appl. No. 10/557,336.

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