Polyphenylene ether copolymer and thermoplastic resin compositio

Details Polyphenylene ether copolymer and thermoplastic resin compositio Polyphenylene ether copolymer and thermoplastic resin compositio

1992-03-26

1993-11-16

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525397, 525905, C08L 7112

Patent

active

052624773

ABSTRACT:
The present invention relates to a polyphenylene ether copolymer and thermoplastic resin compositions thereof which are excellent in heat resistance, thermal stability, mechanical strength, moldability and solvent resistance.
Particularly, the present invention relates to a polyphenylene ether-polyolefin copolymer formed by covalent bonding between a polyphenylene ether and a polyolefin, each of which has a specific melt viscosity. The copolymer is represented by the formula (1):

REFERENCES:
patent: 3661852 (1972-05-01), Flowers et al.
patent: 4065608 (1977-12-01), Beck et al.
patent: 4350797 (1982-09-01), Marzola et al.
patent: 4816515 (1989-03-01), Weiss
patent: 4914153 (1990-04-01), Togo et al.
patent: 4957966 (1990-09-01), Nishio et al.
patent: 5086112 (1992-02-01), Togo et al.
Makormolekulares Kollegium, Feb. 25-27, 1993, pp. 69-70, Lambla et al., "Free Radical Grafting of Activated Monomers onto Polypropylene".
Derwent Abstract 90-095 397/13 of J02047154.
Derwent Abstract 85-267 522/43 of J60181160.
Derwent Abstract 190 02C/11 of J55013706.

Affiliated with

Also associated with

Rating

Polyphenylene ether copolymer and thermoplastic resin compositio does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyphenylene ether copolymer and thermoplastic resin compositio, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyphenylene ether copolymer and thermoplastic resin compositio will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-23223