Polyoxymethylene resin composition

Details Polyoxymethylene resin composition Polyoxymethylene resin composition

2006-06-06

2006-06-06

Nutter, Nathan M. (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S228000, C524S318000, C524S377000, C524S500000, C524S502000, C524S512000

Reexamination Certificate

active

07056965

ABSTRACT:
A polyoxymethylene resin composition, which comprises (A) 100 parts by weight of polyoxymethylene resin, (B) 0.01 to 5 parts by weight of at least one polymer selected from homopolymers of N-vinylcarboxylic acid amides and copolymers of N-vinylcarboxylic acid amides and other vinyl monomers, and (C) 0.01 to 5 parts by weight of at least one compound selected from the group consisting of polyalkylene glycol and its derivatives, fatty acid amides, esters of alcohols and fatty acids, and esters of alcohols and dicarboxylic acids. Such a polyoxymethylene resin composition has a small amount of released formaldehyde gas during production and molding and suppressed scorching generation and is also distinguished in the water resistance and repeated impact resistance of the resulting moldings.

REFERENCES:
patent: 4351916 (1982-09-01), Kohan
patent: 4547539 (1985-10-01), Spivack et al.
patent: 4666963 (1987-05-01), Ravichandran et al.
patent: 5212222 (1993-05-01), Mitsuuchi et al.
patent: 5519075 (1996-05-01), Matsumoto et al.
patent: 6077908 (2000-06-01), Yahiro
patent: 19681563 (1998-10-01), None
patent: 0658599 (1995-06-01), None
patent: 8311302 (1996-11-01), None

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