Polyoxymethylene composition and molded article thereof

Details Polyoxymethylene composition and molded article thereof Polyoxymethylene composition and molded article thereof

1994-08-10

1995-12-26

Clark, W. Robinson

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525157, 525515, 524424, 524433, C08L 7102, C08L 6128

Patent

active

054788951

ABSTRACT:
Polyoxymethylene compositions exhibiting improved heat stability and reduced formation of mold depositions during molding are usefully employed to form molded articles used as parts for electrical or electronic equipment since such parts experience few malfunctions due to formic acid generated from the composition. The preferred composition includes a blend of 100 parts by weight of polyoxymethylene resin with (a) 0.01 to 5.0 parts by weight of an antioxidant, (b) 0.01 to 5.0 parts by weight of a melamine-formaldehyde polycondensate, and (c) 0.001 to 10 parts by weight of at least one metallic compound selected from magnesium oxide, magnesium carbonate, and calcium oxide.

REFERENCES:
patent: 4139575 (1979-02-01), Amann et al.
patent: 4652594 (1987-03-01), Auerbach et al.
Abstract of Japanese 93-232514.
Abstract of Japanese 82-64818E.

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