Polymide-to-substrate adhesion promotion in HDI

Details Polymide-to-substrate adhesion promotion in HDI Polymide-to-substrate adhesion promotion in HDI

2005-06-21

2005-06-21

Alanko, Anita (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S020000, C216S033000, C216S035000, C216S100000, C216S102000, C216S105000, C216S108000, C216S109000

Reexamination Certificate

active

06908561

ABSTRACT:
Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.

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