Polymide resin composition modified with bismaleimide and...

Details Polymide resin composition modified with bismaleimide and... Polymide resin composition modified with bismaleimide and...

2007-05-10

2010-10-19

Sanders, Kriellion A (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S425000, C524S430000, C524S431000, C524S433000, C524S437000, C524S588000, C524S589000

Reexamination Certificate

active

07816437

ABSTRACT:
A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.

REFERENCES:
patent: 6767930 (2004-07-01), Svejda et al.
patent: 2005/0161210 (2005-07-01), Zhong et al.
patent: 2005/0277351 (2005-12-01), Smith et al.

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