Polymerizable planarization layer for integrated circuit structu

Details Polymerizable planarization layer for integrated circuit structu Polymerizable planarization layer for integrated circuit structu

1985-02-01

1986-10-28

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 541, 427 96, B05D 306

Patent

active

046198377

ABSTRACT:
The invention comprises an improvement in the process of manufacturing an integrated circuit structure having stepped topography which comprises coating the integrated circuit structure with a polymerizable material in the substantial absence of a solvent and then polymerizing the material to provide a substantially planar surface on the integrated circuit structure.

REFERENCES:
patent: 4171979 (1979-10-01), Novak et al.
patent: 4258079 (1981-03-01), Economy et al.
patent: 4339526 (1982-07-01), Baise et al.
patent: 4427713 (1984-01-01), White et al.
patent: 4510173 (1985-04-01), Higashikawa et al.
patent: 4518828 (1985-05-01), Economy et al.
White Journ. Electrochem. Soc. Sol. State Sci. and Tech. Jul. 1983, pp. 1543-1548.

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