Polymerizable flux composition for encapsulating the solder in s

Details Polymerizable flux composition for encapsulating the solder in s Polymerizable flux composition for encapsulating the solder in s

1996-03-29

1998-12-22

Ryan, Patrick

Metal treatment

Compositions

Fluxing

148 23, 148 24, 148 25, B23K 3500

Patent

active

058513116

ABSTRACT:
A polymer-based solder paste composition having the strength and corrosion resistance of joints produced by conventional solder technology and the environmental and processing advantages of ICA technology comprises a powdered solder metal with a single component (single package) polymerizable flux composition. The polymerizable flux composition includes 55%-65% by weight of an epoxy such as epoxy novolac, the diglycidyl ethers of bisphenol A and F, and mixtures thereof, 0-15% by weight of a dicarboxylic acid, 9%-11% by weight of a polyalcohol, 3%-5% by weight of an amine thermal curing agent, and the balance including a chelating agent, a defoamer, a thixotrope and a surfactant. Upon heating, the solder metal spontaneously segregates from the flux composition, fuses, and forms a metallurgical joint, while the single-component polymerizable flux composition encapsulates the fused metal in a polymer coating which remains firm but pliable at reflow temperatures.

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