Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1995-06-06
1998-08-18
Berman, Susan W.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 96, 427306, C23C 2600, B05D 512, B05D 304
Patent
active
057956189
ABSTRACT:
There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.
REFERENCES:
patent: 3989767 (1976-11-01), Homma et al.
patent: 3993549 (1976-11-01), Bush et al.
patent: 4093674 (1978-06-01), Tsutsui et al.
patent: 4151220 (1979-04-01), Watanabe et al.
patent: 4152477 (1979-05-01), Horuta et al.
patent: 4496415 (1985-01-01), Sprengling
patent: 4504607 (1985-03-01), Leech
patent: 4752499 (1988-06-01), Enomoto
patent: 5021472 (1991-06-01), Enomoto
patent: 5039762 (1991-08-01), Demarey
patent: 5055321 (1991-10-01), Enomoto
patent: 5106937 (1992-04-01), Yamaya et al.
patent: 5106945 (1992-04-01), Hare
patent: 5137936 (1992-08-01), Akiguichi et al.
Moore, J.A., Editor, "Macromolecular Synthese", Method for the Preparation of Macromolecules, Collective vol. 1, pp. 257-264, 1977.
"Resin Technique for Coating", Kogyo Chosakai Publishing Co., Ltd., p. 272, 1986. (Japanese).
Asai Motoo
Onishi Chie
Berman Susan W.
Ibiden Co. Ltd
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