Polymeric polishing pad containing hollow polymeric microelement

Stock material or miscellaneous articles – Structurally defined web or sheet – Continuous and nonuniform or irregular surface on layer or...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428141, 428143, 428323, 428327, 428402, 4284231, 4284251, 4283135, 4283055, 428332, 428338, 428220, 428152, 428163, 428167, 428156, 428168, 4284088, 51296, 51298, 51302, 51303, 437225, 437228, 437946, 437974, 451527, 451530, B24B 3702, B24B 722

Patent

active

055783627

ABSTRACT:
The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface. The present invention also includes methods for decreasing the effective rigidity of polymeric microelements at the work surface of the article, regenerating the work surface of the article and planarizing a surface of a semiconductor device utilizing the article.

REFERENCES:
patent: 1986849 (1935-01-01), Pohl et al.
patent: 2806772 (1957-09-01), Robie
patent: 3377151 (1968-04-01), Lanham
patent: 3928949 (1975-12-01), Wagner
patent: 4089120 (1978-05-01), Kozischek
patent: 4111667 (1978-09-01), Adams
patent: 4147766 (1979-04-01), Kozischek
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4430155 (1984-02-01), Kozischek et al.
patent: 4512113 (1985-04-01), Budinger
patent: 4543106 (1985-09-01), Parekh
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 4799939 (1989-01-01), Bloecher et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4954140 (1990-09-01), Kawashima et al.
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 5020283 (1991-06-01), Tuttle
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5096854 (1992-03-01), Saito et al.
patent: 5177908 (1993-01-01), Tuttle
patent: 5197999 (1993-03-01), Thomas
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5329734 (1994-07-01), Yu

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polymeric polishing pad containing hollow polymeric microelement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymeric polishing pad containing hollow polymeric microelement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymeric polishing pad containing hollow polymeric microelement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1971435

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.