Polymeric materials and novel thermoplastic resin compositions

Details Polymeric materials and novel thermoplastic resin compositions Polymeric materials and novel thermoplastic resin compositions

1983-05-26

1985-09-24

Briggs, Sr., Wilbert J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525182, 525183, 525438, C08G 8102, C08G 4104

Patent

active

045433925

ABSTRACT:
A polymeric material which is superior in mechanical strength, dimensional stability, moldability and resistances to chemicals, heat and abrasion comprises a copolymer composed of polymer chain moieties of a copolymer containing an imide compound of an .alpha.,.beta.-unsaturated dicarboxylic acid and polymer chain moieties of a polyamide, both chain moieties being bonded to each other. The material may be blended with thermoplastic resins. Furthermore, the material may be reinforced with glass fiber, etc.

REFERENCES:
patent: Re30322 (1980-07-01), Hammer
patent: 2524045 (1950-10-01), Flory
patent: 3136738 (1964-06-01), Hedrick
patent: 3261885 (1966-07-01), Craubner
patent: 3388186 (1968-06-01), Kray
patent: 3539664 (1970-11-01), Kray
patent: 3644571 (1972-02-01), Anderson
patent: 3963799 (1976-06-01), Starkweather
patent: 3966839 (1976-06-01), Sims
patent: 3972961 (1976-08-01), Hammer
patent: 3976720 (1976-08-01), Hammer
patent: 4100223 (1978-07-01), Meyer
patent: 4225476 (1980-09-01), Hammer
patent: 4421892 (1983-12-01), Kasahara et al.

Affiliated with

Also associated with

Rating

Polymeric materials and novel thermoplastic resin compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymeric materials and novel thermoplastic resin compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymeric materials and novel thermoplastic resin compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1614727