Polymeric composite lead wire and method for making same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361760, 361776, 361813, 174 522, 174255, 257690, 257787, 439 66, H01R 900

Patent

active

052970086

ABSTRACT:
Electrical leads are provided for improving access to high density electronic devices. The leads include a polymeric dielectric core comprising a metallic conductive layer having at least two separate conductive paths thereon. The conductive paths are ideally suited to connect a pair of terminals disposed on a circuit element to a pair of conductive surfaces on a printed circuit board, without requiring any additional surface area to meet the lead requirements.

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patent: 4521801 (1985-06-01), Kato et al.
patent: 4673967 (1987-06-01), Hingorany
patent: 4722470 (1988-02-01), Johary
patent: 4762499 (1988-08-01), Johnson, Jr.
patent: 4884335 (1989-12-01), McCoy et al.
patent: 4967260 (1990-10-01), Butt

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