Stock material or miscellaneous articles – Hollow or container type article – Shrinkable or shrunk
Patent
1985-04-18
1997-07-22
Robinson, Ellis
Stock material or miscellaneous articles
Hollow or container type article
Shrinkable or shrunk
206497, 383113, 383908, 428 352, 428 354, 428 357, 428 359, 428 366, 428 367, 428516, 428520, 428518, 525222, B32B 2708, B65D 2108
Patent
active
RE0355674
ABSTRACT:
Linear low density polyethylene is used in multiple layer, molecularly oriented films. Novel blends of linear low density polyethylene with ethylene vinyl acetate copolymer are disclosed, and used in molecularly oriented multiple layer films. Bags made from the multiple layer films are especially useful for shrink packaging, and particularly for shrink packaging of meats having large cavities.
REFERENCES:
patent: 3399250 (1968-08-01), Kirk et al.
patent: 3422055 (1969-01-01), Maloney
patent: 3682767 (1972-08-01), Britton
patent: 4161562 (1979-07-01), Yoshikawa et al.
patent: 4234826 (1980-11-01), Knott et al.
patent: 4247584 (1981-01-01), Widiger et al.
patent: 4254169 (1981-03-01), Schroeder
patent: 4278738 (1981-07-01), Bray et al.
patent: 4289830 (1981-09-01), Knott
patent: 4339507 (1982-07-01), Kurtz et al.
patent: 4357191 (1982-11-01), Bullard et al.
patent: 4357376 (1982-11-01), Nattinger et al.
patent: 4364981 (1982-12-01), Horner et al.
patent: 4367256 (1983-01-01), Beil
patent: 4405667 (1983-09-01), Christensen et al.
patent: 4424243 (1984-01-01), Nishimoto et al.
patent: 4425268 (1984-01-01), Cooper
patent: 4456646 (1984-06-01), Nishimoto et al.
American National Can Company
Robinson Ellis
Schnurr Mary J.
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