Coating processes – Measuring – testing – or indicating
Reexamination Certificate
2005-02-08
2005-02-08
Cameron, Erma (Department: 1762)
Coating processes
Measuring, testing, or indicating
Reexamination Certificate
active
06852354
ABSTRACT:
A polymer/substrate and/or polymer/polymer interface is selected from candidate interfaces using a model that manipulates adhesive characteristics and strain variables, and estimates of their effect on candidate interfaces. The model is preferably used to evaluate properties such as size, shape, and bond geometries. Preferred models involve an atomic level visual representation of a first polymer adhered to either a second polymer or a substrate at the interface by a force, inclusion of strain-related information, and generating data from modeling effects on the interface of strain cycles resulting from intermittently applied force. Particularly preferred interfaces include a polymer having a monomer of the formula:wherein Ra, Rb, Rccomprises a hydroxylated aliphatic side chain; an epoxy glycol; an ethoxy ether; a glycol ether; an adduct of glycol ether and a bisphenol glycol epoxy; an adduct of an epoxy glycol and an amine such as oxydianiline to form a hydroxylamine; an adduct of a glycol ether and a cycloaliphatic epoxy such as oxybiscyclopentene oxide; an adduct of hydroxyethyl side chain and a cycloaliphatic epoxy such as oxybiscylopentene.
REFERENCES:
Iwamoto et al, Proceedings of the MRS '98 Symposium Journal: Electronic Packaging Materials Science X, 515, pp 23-20, 1998.*
Qian et al, Electronic Components and Technology Conference, pp 969-974, 1998.*
Iwamoto, N. E. “Applying Polymer Process Studies Using Molecular Modeling”, Proceedings of the 4thInternational Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Microelectronics 2000) Jun. 18-21, Helsinki, Finland; pp. 182-187.
Iwamoto, N.E. “Advancing Polymer Process Understanding in Package and Board Applications . . . ”. Proceedings of the 50thElectronic Components and Technology Conference; May 21-24, 2000; Las Vegas, NV. pp. 1354-1359.
Iwamoto, N.E. “Stimulating Stress Reliability Using Molecular Modeling Methodologies”. 32ndInternational Symposium on Microelectronics; Chicago, III; Oct. 26-28, 1999, Proceedings pp. 415-420.
Bingham & McCutchen LLP
Cameron Erma
Honeywell International , Inc.
Thompson Sandra P.
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