Polymer sealants/adhesives and use thereof in electronic package

Details Polymer sealants/adhesives and use thereof in electronic package Polymer sealants/adhesives and use thereof in electronic package

1996-08-02

1998-06-30

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528 26, 528 38, 528170, 528171, 528172, 528173, 528174, 528176, 528185, 528188, 528220, 528229, 528350, 428458, C08G 7310, C08G 6926

Patent

active

057735611

ABSTRACT:
The present invention relates generally to a new adhesive comprising a vinyl containing siloxane-containing polyimide for use in TSM capping of electronic package assemblies with adhesive capability of providing a seal band width of less than 4mm and even less than 2mm, solubility in non-toxic and environmentally safe solvents and durable adhesive properties and to a method for making the polyimides, a method for using the polyimides to make electronic packages and electronic packages made using the adhesive. The preferred vinyl-containing siloxane containing polyimide is a block type polymer containing blocks of a dianhydride-aromatic diamine oligomeric reaction product joined by non-vinyl/vinyl containing siloxane diamine forming links.

REFERENCES:
patent: 4480009 (1984-10-01), Berger
patent: 5204399 (1993-04-01), Edelman
"A Novel Approach--Thermoplastic Die Attach Adhesive", by Lincoln Ying, M&T Chemical Inc. P. O. Box 1104, Rahway, New Jersey 07065, IEEE 1986, pp. 285-295.

Affiliated with

Also associated with

Rating

Polymer sealants/adhesives and use thereof in electronic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymer sealants/adhesives and use thereof in electronic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymer sealants/adhesives and use thereof in electronic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1860633