Polymer marker

Semiconductor device manufacturing: process – With measuring or testing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438 15, 1566261, H01L 2166, G01R 3126

Patent

active

06087192&

ABSTRACT:
An embodiment of the instant invention is a method of making a semiconductor device situated within a package with conductive leads extending from the package, the method comprising the steps of: testing a plurality of the semiconductor devices so as to determine defective devices; and marking the defective devices with a polymer marker able to withstand temperatures in excess of 200 C., acids with a pH of less than 2, and basic solutions with a pH of greater than 11. Preferably, the polymer marker is comprised of a surfactant, a solvent, a polymer backbone, and a dye, and may additionally include an adhesion promoter. The surfactant is, preferably, comprised of: SVC-15, isopropanol, and any combination thereof. The solvent is, preferably, comprised of a substance consisting of: ENSOLV, bromopropane, chloropropane, and C.sub.n H.sub.2n+1 X (where X is a halogen and n is between 3 and 5), and any combination thereof. Preferably, the polymer backbone is comprised of: PMMA and an acrylate with a molecular weight between 30 and 100,000 AMU/gram.

REFERENCES:
patent: 4437229 (1984-03-01), Bitler et al.
patent: 5585281 (1996-12-01), Truhitte et al.
Defective Semiconductor Chip Marker Fixture for a Deck Testing Tool. IBM Technical Disclosure Bulletin, vol. 31, No. 3. Aug., 1988. pp. 78-79.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polymer marker does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymer marker, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymer marker will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-541451

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.