Semiconductor device manufacturing: process – With measuring or testing
Patent
1999-09-02
2000-07-11
Monin, Jr., Donald L.
Semiconductor device manufacturing: process
With measuring or testing
438 15, 1566261, H01L 2166, G01R 3126
Patent
active
06087192&
ABSTRACT:
An embodiment of the instant invention is a method of making a semiconductor device situated within a package with conductive leads extending from the package, the method comprising the steps of: testing a plurality of the semiconductor devices so as to determine defective devices; and marking the defective devices with a polymer marker able to withstand temperatures in excess of 200 C., acids with a pH of less than 2, and basic solutions with a pH of greater than 11. Preferably, the polymer marker is comprised of a surfactant, a solvent, a polymer backbone, and a dye, and may additionally include an adhesion promoter. The surfactant is, preferably, comprised of: SVC-15, isopropanol, and any combination thereof. The solvent is, preferably, comprised of a substance consisting of: ENSOLV, bromopropane, chloropropane, and C.sub.n H.sub.2n+1 X (where X is a halogen and n is between 3 and 5), and any combination thereof. Preferably, the polymer backbone is comprised of: PMMA and an acrylate with a molecular weight between 30 and 100,000 AMU/gram.
REFERENCES:
patent: 4437229 (1984-03-01), Bitler et al.
patent: 5585281 (1996-12-01), Truhitte et al.
Defective Semiconductor Chip Marker Fixture for a Deck Testing Tool. IBM Technical Disclosure Bulletin, vol. 31, No. 3. Aug., 1988. pp. 78-79.
Cowens Marvin W.
Roderos Rodel M.
Hoel Carlton H.
Monin, Jr. Donald L.
Peralta Ginette
Telecky Jr. Frederick J.
Texas Instruments Incorporated
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