Polymer interconnect structure

Details Polymer interconnect structure Polymer interconnect structure

1988-12-27

1990-02-20

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

29872, 174 84R, 428328, 428403, 439 66, 439 91, H01R 900, H01R 1101, H01R 4300

Patent

active

049028570

ABSTRACT:
A conductive polymer interconnect structure (10) is comprised of an insulative polymer (18), a silicone or an epoxy, having a plurality of particles (20) arranged therein to provide conductive paths which extend in the z direction. At least a portion of those particles (20) proximate a separate one of the major surfaces of the matrix has at least a portion thereof coated with a solder 24 whose composition is tailored to melt below the cure temperature of the matrix (18). In this way, when the matrix (18) is sandwiched between a pair of conductive members (12 and 14) and the matrix is cured, a metallurgical bond, rather than a mechanical bond, will be formed between the members.

REFERENCES:
H. H. Manko, Solders and Soldering (McGraw Hill, 1979), pp. 110-115.

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