Polymer encapsulation of high aspect ratio materials and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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Details

C523S205000, C524S420000, C524S430000, C524S440000, C524S441000, C524S449000, C524S500000, C524S577000

Reexamination Certificate

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10351386

ABSTRACT:
Embodiments of this invention comprise a pigment comprising one or more substantially spherical-shaped beads, wherein each substantially spherical-shaped bead comprises one or more high aspect ratio particles encapsulated within an encapsulating material. Embodiments also comprise a resinous composition comprising said pigment. Yet further embodiments comprise a method of preparing said pigment via suspension polymerization.

REFERENCES:
patent: 3635895 (1972-01-01), Kramer
patent: 3764456 (1973-10-01), Woodhams
patent: 3772200 (1973-11-01), Livesay
patent: 3941731 (1976-03-01), Camelon et al.
patent: 4001184 (1977-01-01), Scott
patent: 4112036 (1978-09-01), Woodhams et al.
patent: 4217438 (1980-08-01), Brunelle et al.
patent: 4238524 (1980-12-01), LaLiberte et al.
patent: 4598020 (1986-07-01), Panush
patent: 4610808 (1986-09-01), Kleiner
patent: 4699510 (1987-10-01), Alguard
patent: 4771086 (1988-09-01), Martin
patent: 4813973 (1989-03-01), Winnik et al.
patent: 5005873 (1991-04-01), West
patent: 5030697 (1991-07-01), Hugl et al.
patent: 5108863 (1992-04-01), Hsieh et al.
patent: 5128419 (1992-07-01), Fong et al.
patent: 5137364 (1992-08-01), McCarthy
patent: 5142018 (1992-08-01), Sakashita et al.
patent: 5151491 (1992-09-01), Sakashita et al.
patent: 5171772 (1992-12-01), Hoy et al.
patent: 5201921 (1993-04-01), Luttermann et al.
patent: 5314072 (1994-05-01), Frankel et al.
patent: 5326692 (1994-07-01), Brinkley et al.
patent: 5329127 (1994-07-01), Becker et al.
patent: 5452379 (1995-09-01), Poor
patent: 5510619 (1996-04-01), Zachmann et al.
patent: 5553714 (1996-09-01), Cushman et al.
patent: 5573909 (1996-11-01), Singer et al.
patent: 5593773 (1997-01-01), McKay et al.
patent: 5703229 (1997-12-01), Krutak et al.
patent: 5744223 (1998-04-01), Abersfelder et al.
patent: 5838451 (1998-11-01), McCarthy
patent: 5881196 (1999-03-01), Phillips
patent: 5925716 (1999-07-01), Fu et al.
patent: 6099930 (2000-08-01), Cyr et al.
patent: 6160787 (2000-12-01), Marquardt, Jr. et al.
patent: 6200628 (2001-03-01), Rozumek et al.
patent: 6219329 (2001-04-01), Tanaka et al.
patent: 6251680 (2001-06-01), Fu et al.
patent: H1975 (2001-07-01), Rosendale et al.
patent: 6297508 (2001-10-01), Barmore et al.
patent: 6317947 (2001-11-01), Ruschmann
patent: 6355420 (2002-03-01), Chan
patent: 6380547 (2002-04-01), Gonzalez et al.
patent: 6406789 (2002-06-01), McDaniel et al.
patent: 6451102 (2002-09-01), Hilder et al.
patent: 6500526 (2002-12-01), Hannington
patent: 6514617 (2003-02-01), Hubbard et al.
patent: 6572784 (2003-06-01), Coombs et al.
patent: 6589626 (2003-07-01), Seilnfreund et al.
patent: 6638593 (2003-10-01), Seilnfreund et al.
patent: 6673420 (2004-01-01), Muller et al.
patent: 6707539 (2004-03-01), Seilnfreund et al.
patent: 6984682 (2006-01-01), Polonka et al.
patent: 7030174 (2006-04-01), Yatake
patent: 2003/0004248 (2003-01-01), Wakamura et al.
patent: 2003/0012562 (2003-01-01), Lawandy et al.
patent: 2003/0195274 (2003-10-01), Nakamura et al.
patent: 2005/0111342 (2005-05-01), Wisnudel et al.
patent: 2005/0119370 (2005-06-01), Paul et al.
patent: 2005/0124745 (2005-06-01), Bauer et al.
patent: 0 121 261 (1984-10-01), None
patent: 0154739 (1985-09-01), None
patent: 0 181 228 (1993-01-01), None
patent: 0 927 750 (1999-07-01), None
patent: 1 220 165 (2002-07-01), None
patent: 1 170 965 (1969-11-01), None
patent: 2264558 (1993-09-01), None
patent: 2330408 (1999-04-01), None
patent: 11-21376 (1999-01-01), None
patent: 11-279434 (1999-10-01), None
patent: WO97/15390 (1997-05-01), None
patent: WO98/31011 (1998-07-01), None
patent: WO99/52708 (1999-10-01), None
patent: WO 00/14736 (2000-03-01), None
patent: WO 03/087888 (2003-10-01), None
patent: WO 03/105075 (2003-12-01), None
Merriam-Webster's Collegiate Dictionary, 10thEdition, Merriam-Webster, Inc., Springfield, MA. 1997 (p. 857).
Japanese Patent No. JP61049817; Publication date: Mar. 11, 1986; Abstract Only; 1 p.
Japanese Patent No. JP61159453; Publication date: Jul. 19, 1986; Abstract Only; 1 p.
Japanese Patent No. JP62095345; Publication Date: May 1, 1987; Abstract Only; 1 p.
Japanese Patent No. JP62096565; Publication Date: May 6, 1987; Abstract Only; 1 p.
Japanese Patent No. JP62096566; Publication date: May 6, 1987; Abstract Only; 1 p.
International Search Report, International Application No. PCT/US2005/019670; International Filing Date: Jun. 30, 2005; Applicant's File Reference: 08CL153501; Date of Mailing Nov. 15, 2005; 7 pages.
JP11140343A2—Abstract only, two pages.
International Search Report, International Application No. PCT/US2004/001727, International Search Jul. 5, 2004, Date of Mailing Jul. 13, 2004; 3 pages.

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