Polymer composition for foam molding

Details Polymer composition for foam molding Polymer composition for foam molding

1991-06-11

1993-01-19

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

521 79, 521 81, 521908, C08J 910

Patent

active

051807548

ABSTRACT:
Polymer compositions for molding in the presence of a foaming agent which comprise at least a polyolefin resin as a base resin and low polarity boron compound powder which is not decomposed at a foaming temperature, such as boron nitride powder as a nucleator. Polymer compositions of the invention are useful for formation of a foamed insulating layer on a conductive material by way of foam molding. By using said polymer composition, a foamed insulating layer excellent in insulation properties which has small dielectric loss factor, tan .delta., at high frequency and high extent of foaming of not less than 70% can be obtained.

REFERENCES:
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patent: 3976605 (1976-08-01), Matsunaga et al.
patent: 4560829 (1985-12-01), Reed et al.
patent: 4716073 (1987-12-01), Randa
patent: 4764538 (1988-08-01), Buckmaster et al.
patent: 4877815 (1989-10-01), Buckmaster et al.
patent: 5023279 (1991-06-01), Buckmaster et al.

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