Polymer composition for bonding to copper

Details Polymer composition for bonding to copper Polymer composition for bonding to copper

1974-04-22

1976-01-20

Hoke, V. P.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C08G 600

Patent

active

039337375

ABSTRACT:
A composition for bonding to copper comprised of copolymers and ionic copolymers of ethylene and an .alpha.,.beta.-monoethylenically unsaturated carboxylic acid having incorporated therein a copper deactivating amount of a copper stabilizer or deactivator. The composition has improved moisture-resistant bond strength on copper and laminates of copper and the composition may be employed as a protective sheathing for cables.

REFERENCES:
patent: 3110696 (1963-11-01), Dexter
patent: 3117104 (1964-01-01), Bown et al.
patent: 3233036 (1966-02-01), Jachimowicz
patent: 3404134 (1968-10-01), Rees
patent: 3462517 (1969-08-01), Hansen et al.
patent: 3484285 (1969-12-01), Hansen
patent: 3549572 (1970-12-01), Minagawa et al.

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