Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2007-02-27
2007-02-27
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
C051S308000, C051S309000, C051S298000, C106S003000
Reexamination Certificate
active
10903425
ABSTRACT:
The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The polymeric shell has a solid structure and a hardness lower than the hardness of the particle core. The abrasive particles have an average particle size of less than or equal to about 2 micrometers dispersed in the liquid media.
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Barney Nathaniel A.
Partch Richard E.
Quanci John
Wang Hongyu
Biederman Blake T.
Marcheschi Michael
Rohm and Haas Electronic Materials CMP Holdings Inc.
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