Polyimidesiloxane solution composition

Coating processes – With post-treatment of coating or coating material – Heating or drying

Reexamination Certificate

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Details

C524S268000, C524S492000, C524S588000, C516S137000, C516S139000, C516S144000, C516S191000, C528S025000

Reexamination Certificate

active

07491427

ABSTRACT:
[PROBLEMS] To provide a polyimidesiloxane solution composition that is excellent in defoaming ability and that can maintain the wettability of an outer lead bonded portion on a wiring board at a high level, even when it is applied on the surface of the wiring board and then cured, to form an insulating cured film.[MEANS FOR SOLVING PROBLEMS] A polyimidesiloxane solution composition which comprises an organic solvent, polyimidesiloxane soluble in the organic solvent, a curable components such as an epoxy compound and a polyvalent isocyanate compound, and a silicone defoamer, wherein the silicone defoaming agent comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain or a terminal moiety, and a micro-powder silica.

REFERENCES:
patent: 05-311144 (1993-11-01), None
patent: 10-219225 (1998-08-01), None
patent: 10-231424 (1998-09-01), None
patent: 2001-302913 (2001-10-01), None
patent: 2002-012664 (2002-01-01), None
patent: 2003/192910 (2003-07-01), None
patent: 2004-124015 (2004-04-01), None
International Search Report, PCT/JP2005/002749, May 10, 2005.
International Preliminary Report on Patentability and Written Opinion of the International Searching Authority, PCT/JP2005/002749, Sep. 28, 2006.

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