Polyimidesiloxane film of low heat-conductivity

Details Polyimidesiloxane film of low heat-conductivity Polyimidesiloxane film of low heat-conductivity

1994-06-28

1995-12-05

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

528 28, 528 38, 525431, C08G 7726

Patent

active

054730406

ABSTRACT:
A polyimidesiloxane film having a low heat conductivity without damaging the heat resistance intrinsic of polyimide, a high hardness and a superior adherence onto its substrate, is provided, which polyimidesiloxane film comprises a cross linked copolymer having repetition units expressed by the formula (1): ##STR1## wherein R.sup.1 independently is a tetravalent organic group, R.sup.2 independently is a divalent organic group of 2 to 30 C, R.sup.3 independently is represented by 4 specified formulas, R.sup.4 and R.sup.5 each are a specified organic group, and n, p, q, and r each have a value within a range satisfying 3 specified equations, and which film exhibited a heat resistance of 511.degree. C. or higher, a hardness of 3H or higher and a heat conductivity of 0.160 or lower.

REFERENCES:
patent: 3948835 (1976-04-01), Greber et al.
patent: 4818806 (1989-04-01), Kunimune et al.
patent: 5063115 (1991-11-01), Merriman, Jr. et al.
patent: 5073607 (1991-12-01), Katz
patent: 5114757 (1992-05-01), Linde et al.

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