Polyimides for mold release

Coating processes – Mold coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427135, 427379, 4273855, 4284735, 528125, 528128, 528176, 528353, B05D 302

Patent

active

050046276

ABSTRACT:
A method of treating the surface of a mold to improve its release characteristics is disclosed. A coating of a polyamic acid solution comprising the reaction product of 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane and an aromatic tetracarboxylic acid or dianhydride or ester derivative thereof is applied to the mold surface. The coating is cured at elevated temperatures to remove the solvent and form the corresponding polyimide.

REFERENCES:
patent: 3188226 (1965-06-01), Jense
patent: 4293684 (1981-10-01), Takekoshi
patent: 4603061 (1986-07-01), St. Clair et al.
patent: 4816516 (1989-03-01), Yamaya et al.
patent: 4831977 (1989-05-01), Presswood
patent: 4879182 (1989-11-01), Presswood et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyimides for mold release does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimides for mold release, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimides for mold release will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-326150

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.