Polyimides and methods for making and using the same

Details Polyimides and methods for making and using the same Polyimides and methods for making and using the same

1985-08-19

1986-11-25

Phynes, Lucille M.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C09J 314, C09J 316

Patent

active

046247270

ABSTRACT:
A low temperature processable, thermoplastic polyimide and methods for making and using the same. The polyimide has repeating polymer units of the formula ##STR1## wherein n is 2 to about 20 and the molecular weight of the polymer chain is about 5,000 to about 50,000. The polymer is made by reacting 4,4'-(hexafluoroisopropylidene)bis(o-phthalic anhydride) with a diamine having the formula H.sub.2 N(CH.sub.2).sub.n NH.sub.2 wherein n is 2 to about 20 to form a polyamic acid. The polyamic acid is imidized to form the polyimide described above. The polyimide is particularly adapted to use as a hot melt adhesive by placing it between two articles and applying heat and pressure.

REFERENCES:
patent: 3356648 (1967-12-01), Rogers
patent: 3649601 (1972-03-01), Critchley et al.
patent: 3959350 (1976-05-01), Rogers
patent: 4111906 (1978-09-01), Jones et al.
patent: 4477648 (1984-10-01), Jones et al.

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