Polyimide thermal isolation mesa for a thermal imaging system

Details Polyimide thermal isolation mesa for a thermal imaging system Polyimide thermal isolation mesa for a thermal imaging system

1989-07-31

1991-09-10

Fields, Carolyn E.

Radiant energy

Infrared-to-visible imaging

Including detector array

250352, G01J 506

Patent

active

050476440

ABSTRACT:
A mesa (31) is formed from polyimide (or a similar polymer material) to achieve a high thermal resistance. In an exemplary thermal imaging application, an array of thermal isolation mesa structures (30) are disposed on an integrated circuit substrate (20) for electrically connecting and bonding a corresponding focal plane array (5) of thermal sensors (10). Each mesa structure (30) includes a polyimide mesa (31) over which is formed a metal conductor (32) that extends from the top of the mesa down a mesa sidewall to an adjacent IC contact pad (22). When the focal plane array (5) is bonded to the corresponding array of thermal isolation mesa structure (30), a thermally isolated, but electrically conductive path is provided between the sensor signal electrode (16) of the thermal sensor (10) and the corresponding contact pad (22) of the integrated circuit substrate (20).

REFERENCES:
patent: 4009516 (1977-03-01), Chiang et al.
patent: 4143269 (1979-03-01), McCormack et al.
patent: 4147562 (1979-04-01), Chiang et al.
patent: 4214165 (1980-07-01), Asawa
patent: 4354109 (1982-10-01), Gelpey et al.
patent: 4663529 (1977-05-01), Jenner et al.
patent: 4740700 (1988-04-01), Shaham et al.
patent: 4803363 (1989-02-01), Gaalema et al.

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