Polyimide substrate having a textured surface and metallizing su

Details Polyimide substrate having a textured surface and metallizing su Polyimide substrate having a textured surface and metallizing su

1989-07-11

1990-12-04

Ryan, Patrick

Stock material or miscellaneous articles

Surface property or characteristic of web, sheet or block

4284735, 428901, 427 96, 427250, 427306, 427310, B32B 900

Patent

active

049753274

ABSTRACT:
The adhesion of metal to a polyimide substrate is enhanced by depositing onto at least one surface of the polyimide a thin film of metal such as copper and heating in air to cause the deposited metal to texturize that surface by producing asperities that are at least 0.05 .mu.m in average height and average breadth. In doing so, metal oxide clusters are formed at the textured surface. When the textured surface is metallized, the resulting composite resists delamination even at soldering temperatures.

REFERENCES:
patent: 3562005 (1971-02-01), DeAngelo et al.
patent: 4720401 (1988-01-01), Ho et al.
patent: 4725504 (1988-02-01), Knudsen et al.
patent: 4806395 (1989-02-01), Walsh
IBM Journal of R&D, RIE PI/CU Laminates, Ruoff et al., pp. 626-630, vol. 32(5), 9/1988.

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