Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1992-03-31
1992-10-20
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205224, C25D 554
Patent
active
051567326
ABSTRACT:
Disclosed is a method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of 120.degree. C. or higher thereby to modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer. Also disclosed is a method of preparing a printed wiring board having the copper-polyimide substrate, comprising a first step of etching the surface of a polyimide resin substrate, a second step of applying a catalyst to the substrate followed by electroless plating thereof to give a copper-polyimide substrate, and a third step of forming a circuit on the thus prepared copper-polyimide substrate; which is characterized in that a hydrophilic denatured layer is formed on the surface of the polyimide resin by the etching of the first-step treatment, and the substrate is heat-treated at a temperature of 120.degree. C. or higher after the copper-plating treatment of the second step or before the circuit-forming treatment of the third step to be effected by plating a conductive metal on the surface of the substrate by the use of a free cyan or cyan compound, whereby the hydrophilic denatured layer is modified into a heat-resistant copper-diffusion preventing layer. The metal plating layer has an excellent adhesion strength capable of withstanding thermal shocks. The substrate can be used for producing electronic parts having high reliability with stable operationability.
REFERENCES:
patent: 4517254 (1985-05-01), Grapentin
patent: 4775449 (1988-10-01), Dumas
patent: 4842946 (1989-06-01), Foust
Kato Hideki
Ogasawara Shuichi
Tomioka Daizo
Sumitomo Metal & Mining Co., Ltd.
Tufariello T. M.
LandOfFree
Polyimide substrate and method of manufacturing a printed wiring does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyimide substrate and method of manufacturing a printed wiring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide substrate and method of manufacturing a printed wiring will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-189963