Polyimide substrate and method of manufacturing a printed wiring

Details Polyimide substrate and method of manufacturing a printed wiring Polyimide substrate and method of manufacturing a printed wiring

1992-03-31

1992-10-20

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205224, C25D 554

Patent

active

051567318

ABSTRACT:
A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin and, if required, further applying an electrolytic copper plating successively thereto, wherein heat treatment is applied to the substrate after the electroless copper-plating treatment within a temperature range from 120.degree. to 420.degree. C. The metal plating layer has an excellent adhesion capable of withstanding thermal shocks. The substrate can be used for producing electronic parts having high reliability with stable operationability.

REFERENCES:
patent: 4517254 (1985-05-01), Grapentin
patent: 4775449 (1988-10-01), Dumas
patent: 4842946 (1989-06-01), Foust

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