Polyimide resin from bis-imide, polyphenol and dicyandiamide

Details Polyimide resin from bis-imide, polyphenol and dicyandiamide Polyimide resin from bis-imide, polyphenol and dicyandiamide

1988-04-28

1989-10-24

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528171, 528173, 528205, 528322, C08G 7310

Patent

active

048763250

ABSTRACT:
A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol).

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patent: 4038251 (1977-07-01), Forgo et al.
patent: 4043986 (1977-08-01), Gruffaz et al.
patent: 4393188 (1983-07-01), Takahashi et al.
patent: 4435560 (1984-03-01), Takahashi et al.
patent: 4463147 (1984-07-01), Diethelm et al.
patent: 4482703 (1984-11-01), Takahashi et al.
patent: 4525572 (1985-06-01), Diethelm et al.
patent: 4526835 (1985-07-01), Takahashi et al.

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