Polyimide resin for cast on copper laminate and laminate produce

Details Polyimide resin for cast on copper laminate and laminate produce Polyimide resin for cast on copper laminate and laminate produce

1999-01-15

2000-10-17

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528125, 528128, 528170, 528172, 528173, 528183, 528185, 528220, 528229, 528350, 428209, 4284111, 428458, 4284735, 428457, C08G 7310, B32B 300

Patent

active

061334081

ABSTRACT:
A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.

REFERENCES:
patent: 4883718 (1989-11-01), Ohta et al.
patent: 5200474 (1993-04-01), Chen et al.
patent: 5290909 (1994-03-01), Chen et al.
patent: 5300619 (1994-04-01), Okada et al.
patent: 5372891 (1994-12-01), Yu et al.
patent: 5830564 (1998-11-01), Kohno et al.
patent: 5849397 (1998-12-01), Kohno et al.

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