Polyimide resin compositions

Details Polyimide resin compositions Polyimide resin compositions

1988-04-14

1989-12-05

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524506, 524514, 524588, 524425, 524431, 524451, 524404, 524437, 524401, 524424, 524730, 524731, 525422, 525431, C08K 318

Patent

active

048853291

ABSTRACT:
A semiconductor encapsulating material is obtained from a polyimide resin composition comprising (A) a polyaminobismaleimide resin, (B) a silicone monomer and/or oligomer having a hydroxyl or alkoxyl group bonded to a silicon atom and mixtures thereof, and (C) an inorganic filler wherein the weight ratio of polyaminobismaleimide resin (A) to silicone component (B) ranges from 99.5/0.5 to 70/30, and the weight ratio of polyaminobismaleimide resin (A) to inorganic filler (C) ranges from 100/50 to 100/1000.

REFERENCES:
patent: 3909475 (1975-09-01), Schneider
patent: 4238591 (1980-12-01), Cassat et al.
patent: 4361690 (1982-11-01), Locatelli

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