Polyimide resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

524600, 525432, C08K 714, C08K 706, C08K 702

Patent

active

048473111

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

This invention relates to a novel polyimide resin composition having excellent high-temperature stability, dimensional stability and mechanical strength.


BACKGROUND OF THE INVENTION

Polyimide obtained by reacting tetracarboxylic acid dianhydride with diamine is hereafter expected for a wide use in areas where high-temperature stability is required, because of its various excellent properties and good thermal stability.
Many polyimides which have so far been developed exhibit excellent properties and yet they have an outstanding high-temperature stability accompanied by a poor processability. On the other hand the resin developed for improving the processability is inferior in the high-temperature stability and solvent resistance. Thus the performance of polyimide has both merits and drawbacks.
The object of this invention is to provide a novel polyimide resin composition having the excellent high-temperature stability, dimensional stability and mechanical strength.


DISCLOSURE OF THE INVENTION

The present inventors have investigate extensively to achieve the above object. Accordingly, they have found that a polyimide resin composition comprising polyimide and a specific amount of fibrous reinforcing materials is effective in particular. Thus the present invention has been completed.
That is, the present invention is a polyimide resin composition which comprises 100 parts by weight of polyimide having recurring units of the following formula (I): ##STR2## where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 or more carbons, cyclic aliphatic radical, monocyclic aromatic radical, fused polycyclic radical and polycyclic aromatic radical wherein the aromatic radicals are linked to one another directly or via bridged member, and from 5 to 100 parts by weight of a fibrous reinforcing material.
Polyimide which is used in the present invention is prepared by conducting a dehydrating ring-closure of polyamic acid obtained by reacting an ether-diamine represented by the following formula (IV): ##STR3## where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide with a tetracarboxylic acid dianhydride represented by the following formula (V): ##STR4## where R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 or more carbons, cyclic aliphatic radical, monocyclic aromatic radical, fused polycyclic radical and polycyclic aromatic radical wherein the aromatic radicals are linked to one another directly or via bridge member.
Ether-diamine in use for the method includes, for example, bis[4-(3-aminophenoxy)phenyl]methane, 1,1-bis[4-(3-aminophenoxy)phenyl]ethane, 1,2-[4-(3-aminophenoxy)phenyl]ethane, 2,2-bis[4-(3-aminophenoxy)-phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]butane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4'-bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone, bis[4-(3-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl]sulfoxide, bis[4-(3-aminophenoxy)phenyl]sulfone and bis[4-(3-aminophenoxy)phenyl]ether. These diamine can be used alone or in mixtures of two or more.
Particularly preferred ether-diamine is 4,4'-bis-(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane and bis[4-(3-aminophenoxy)phenyl]sulfide.
Tetracarboxylic acid dianhydride used in the method includes, for example, ethylenetetracarboxylic dianhydride, cyclopentanecarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'benzophenonetetra-carboxylic dianhydride, 2,2',3,3'-benzophenonebenzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxy

REFERENCES:
patent: 3129105 (1964-04-01), Berry et al.
patent: 3830777 (1974-08-01), Burton
patent: 4535101 (1985-03-01), Lee et al.
patent: 4725642 (1988-02-01), Gannett et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyimide resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide resin composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-437725

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.