Polyimide precursor resin composition and semiconductor device u

Details Polyimide precursor resin composition and semiconductor device u Polyimide precursor resin composition and semiconductor device u

1985-12-10

1988-07-19

Herbert, Thomas J.

Stock material or miscellaneous articles

Composite

Of polyimide

428429, 428432, 428450, 428458, 428929, 528 26, B32B 2706, B32B 1508, C08G 7704

Patent

active

047584769

ABSTRACT:
A polyimide precursor resin composition comprising (a) a poly(amic acid) containing siloxane linkages, (b) an aminosilane, and (c) a solvent for both the components (a) and (b), can form a polyimide film excellent in adhesiveness and heat resistance and is suitable for producing a semiconductor device having high reliability.

REFERENCES:
patent: 4416973 (1983-11-01), Goff
patent: 4430418 (1984-02-01), Goff
patent: 4454220 (1984-06-01), Goff
patent: 4672099 (1987-06-01), Kunimune et al.

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