Polyimide precursor composition, polyimide composition, process

Details Polyimide precursor composition, polyimide composition, process Polyimide precursor composition, polyimide composition, process

1997-03-18

1998-11-24

Yoon, Tae

Coating processes

Nonuniform coating

Mask or stencil utilized

430322, 101114, B41M 112, B05D 132

Patent

active

058403698

ABSTRACT:
A polyimide precursor composition which is produced by (i) providing a polyamide acid solution obtained by reacting an aromatic tetracarboxylic acid component and a diamine component in the presence of an oxygen-containing solvent and (ii) subjecting said polyamide acid solution to heat treatment. The polyimide precursor composition exhibits a desirable apparent viscosity and a desirable thixotropic property and it excels in film forming ability, and because of this, it enables the formation a high quality relief pattern film with no defect and which excels in form retention by way of the screen printing.
Further, the polyimide precursor composition is extremely suitable for the formation of a relief pattern by way of screen printing in the production of electronic, electric, optical, or precision devices, wherein the relief pattern is required to have a reduced dielectric constant and a reduced residual stress and to have a sufficient heat resistance, moisture resistance, physical strength, and chemical stability.

REFERENCES:
patent: 3700649 (1972-10-01), Boram et al.
patent: 3983093 (1976-09-01), Williams, III et al.
patent: 4524171 (1985-06-01), Bakshi et al.
patent: 4960824 (1990-10-01), Olson et al.
patent: 5175367 (1992-12-01), Auman et al.
patent: 5310862 (1994-05-01), Nomura et al.
patent: 5322924 (1994-06-01), Chuang et al.
patent: 5332799 (1994-07-01), Blum et al.
patent: 5478718 (1995-12-01), Maruta et al.
patent: 5554684 (1996-09-01), Choi et al.

Affiliated with

Also associated with

Rating

Polyimide precursor composition, polyimide composition, process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide precursor composition, polyimide composition, process , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide precursor composition, polyimide composition, process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1699715