Polyimide multilayer wiring substrate

Details Polyimide multilayer wiring substrate Polyimide multilayer wiring substrate

1995-05-24

1997-11-11

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 361784, H05K 100

Patent

active

056867026

ABSTRACT:
A polyimide multilayer wiring substrate that includes a plurality of wiring layer blocks, each of which include a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by way of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting the anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure including N pieces of wiring layer blocks.

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K. Hermann, "Multilayer Laminates", IBM Technical Disclosure Bulletin, vol. 11, No. 8, Jan. 1969.

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