Polyimide multilayer wiring board and method of producing same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174259262, 361785, H05K 100

Patent

active

053212100

ABSTRACT:
A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4588642 (1986-05-01), Ochiumi
patent: 4666254 (1987-05-01), Itoh et al.
patent: 4700276 (1987-10-01), Freyman et al.
patent: 4827083 (1989-05-01), Inasalea et al.
patent: 4882454 (1989-11-01), Peterson et al.
patent: 4950623 (1990-08-01), Dishon
patent: 5001542 (1991-03-01), Tsukagoshi et al.

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