Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1992-01-09
1994-06-14
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174259262, 361785, H05K 100
Patent
active
053212100
ABSTRACT:
A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.
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Hasegawa Shinichi
Ishida Hisashi
Kimbara Kohji
Figlin Cheryl R.
NEC Corporation
Picard Leo P.
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