Electricity: electrical systems and devices – Miscellaneous
Patent
1983-02-22
1984-08-07
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
174 685, H05K 103
Patent
active
044647042
ABSTRACT:
A method of fabricating a "hybrid" multilayer printed circuit board combining two dissimilar plastic layers of polyimide resin/glass and of epoxy resin/glass laminates. The finished hybrid multilayer printed circuit board is for, e.g., the support of and electrical interconnection to a plurality of magnetizable memory cores. The method includes sandwiching a plurality of epoxy-glass printed circuit boards having the desired copper patterns on both sides between two polyimide-glass printed circuit boards, each having the desired copper pattern on only one side. All the printed circuit boards are laminated with epoxy-glass prepreg to form a single hybrid multilayer printed circuit board consisting of the sandwiched epoxy-glass printed circuit boards and the sandwiching polyimide-glass printed circuit boards. Interconnections between patterned layers are formed by copper-plated through-holes.
REFERENCES:
patent: 3508330 (1970-04-01), Kubik
patent: 3654097 (1972-04-01), Degnan
patent: 3691632 (1972-09-01), Smith
patent: 3739469 (1973-06-01), Dougherty
patent: 3740678 (1973-06-01), Hill
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 3895158 (1975-07-01), Gause et al.
patent: 4030190 (1977-06-01), Varker
Huie Jaken Y.
Jacobus Dan
Grace Kenneth T.
Kucia R. R.
Scott Thomas J.
Sperry Corporation
Truex Marshall M.
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