Stock material or miscellaneous articles – Composite – Of polyimide
Reexamination Certificate
2005-06-21
2005-06-21
Hightower, P. Hampton (Department: 1711)
Stock material or miscellaneous articles
Composite
Of polyimide
C428S209000, C428S457000, C428S473500, C428S901000, C528S125000, C528S126000, C528S128000, C528S170000, C528S172000, C528S173000, C528S179000, C528S183000, C528S188000, C528S220000, C528S229000, C528S350000, C528S351000, C528S353000, C525S420000, C525S432000, C525S436000, C264S165000, C264S175000, C264S176100, C264S212000, C264S299000, C264S319000
Reexamination Certificate
active
06908685
ABSTRACT:
The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
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Auman Brian C.
Sawasaki Kouichi
Summers John D.
Uhara Kenji
Yasuda Naofumi
DuPont-Toray Co. Ltd.
E. I. du Pont de Nemours and Company
Hampton Hightower P.
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