Polyimide film/metal foil lamination

Stock material or miscellaneous articles – Composite – Of epoxy ether

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428462, 4284735, B32B 1508, B32B 2706, B32B 2700

Patent

active

046264744

ABSTRACT:
Polyimide films can be laminated to metal foils by the use of an epoxy adhesive composition which consists essentially of a predominant amount of an epoxy resin and a suitable curing agent for the epoxy resin. Optional additives which can be used in lesser amount than the epoxy resin includes flexibilizers, accelerators, solvents and surfactants.

REFERENCES:
patent: 3717543 (1973-02-01), Sinclair et al.
patent: 3904813 (1975-09-01), Groff
patent: 3981691 (1976-09-01), Cuneo
patent: 4295912 (1981-10-01), Burns
patent: 4525542 (1985-06-01), De Gooyer
Chem. Ab., V. 87, #86048c (1977), Abstracting Japan Kokai, 77,65,576.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyimide film/metal foil lamination does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide film/metal foil lamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide film/metal foil lamination will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2292425

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.