Polyimide film having high adhesiveness and method for...

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Reexamination Certificate

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C428S473500, C525S432000, C525S436000, C528S335000, C528S338000, C528S340000, C528S342000, C528S347000, C528S348000, C528S350000, C528S353000

Reexamination Certificate

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07811660

ABSTRACT:
A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.

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