Polyimide film for flexible printed board and flexible...

Details Polyimide film for flexible printed board and flexible... Polyimide film for flexible printed board and flexible...

2006-03-28

2006-03-28

Zarabian, Amir (Department: 2822)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S214000, C528S183000

Reexamination Certificate

active

07018704

ABSTRACT:
The present invention provides a flexible printed circuit which is free from curl, torsion and warpage due to temperature change and excellent flexural endurance. By using polyimide film having an average coefficient of thermal expansion of 1.0×10−5to 2.5×10−5cm/cm/° C. in a temperature range of 100° C. to 200° C. and a stiffness value of 0.4 to 1.2 g/cm as the base film for the flexible printed circuit, a flexible printed circuit having excellent thermal dimensional stability and flexural endurance can be prepared.

REFERENCES:
patent: 5432001 (1995-07-01), Serafini et al.
patent: 2002/0010311 (2002-01-01), Edman et al.
patent: 0786928 (1997-07-01), None
patent: 6-6360 (1994-01-01), None
patent: 11-227099 (1999-08-01), None
patent: 11-298102 (1999-10-01), None
patent: 2000-299359 (2000-10-01), None
International Search Report from Corresponding PCT Application No. PCT/JP02/10117, dated Dec. 24, 2002, 1 page.

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