Polyimide film and laminate having metal layer and same

Details Polyimide film and laminate having metal layer and same Polyimide film and laminate having metal layer and same

2007-09-11

2007-09-11

Tran, Thao (Department: 1711)

Stock material or miscellaneous articles

Composite

Of polyimide

C428S458000, C528S170000

Reexamination Certificate

active

10667134

ABSTRACT:
A polyimide film of the present invention is a polyimide film having a dynamic viscoelasticity whose tan δ peak is located in a range of not less than 310° C. but not more than 410° C., and whose tan δ value at 300° C. is not more than 0.05, or a polyimide film prepared by copolymerizing (a) an acid dianhydride component including a biphenyltetracarboxylic dianhydride and a pyromellitic dianhydride, and (b) a diamine component, and the polyimide film having such an etching speed that one side thereof is etched with a 1N potassium hydroxide solution at an etching speed of 0.1 μm/minute (one side) or higher. The polyimide film of the present invention possesses film properties that are necessary for use in an electronic raw material for flexible printed circuit boards and the like, and is suitable as an electronic raw material.

REFERENCES:
patent: 4426253 (1984-01-01), Kreuz et al.
patent: 4568715 (1986-02-01), Itatani et al.
patent: 5081229 (1992-01-01), Akahori et al.
patent: 5166308 (1992-11-01), Kreuz et al.
patent: 5203955 (1993-04-01), Viehbeck et al.
patent: 5668247 (1997-09-01), Furutani et al.
patent: 6340518 (2002-01-01), Kitahara et al.
patent: 6350844 (2002-02-01), Ono et al.
patent: 6555238 (2003-04-01), Uhara et al.
patent: 2004/0067349 (2004-04-01), Okamura et al.
patent: 85 1 03494 (1986-11-01), None
patent: 05-078503 (1993-03-01), None
patent: 05-202206 (1993-08-01), None
patent: 09-235373 (1997-09-01), None
patent: 10-097081 (1998-04-01), None
patent: 11-054862 (1999-02-01), None
patent: 11-054864 (1999-02-01), None
patent: 2000-159887 (2000-06-01), None
patent: 2000297163 (2000-10-01), None
patent: 2001-072781 (2001-03-01), None
patent: 2001-270034 (2001-10-01), None
patent: 02/064363 (2002-08-01), None
Yamada, et al., “Relationship between Structure and Singl Lap Shear Strength of Thermoplastic Polyimides (1)”, Japanese Adhesion Society Proceedings, vol. 32, No. 9 (1996), pp. 346-353 (ABSTRACT).

Affiliated with

Also associated with

Rating

Polyimide film and laminate having metal layer and same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide film and laminate having metal layer and same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide film and laminate having metal layer and same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3753256