Polyimide copolymer film for lift-off metallization

Details Polyimide copolymer film for lift-off metallization Polyimide copolymer film for lift-off metallization

1994-03-04

1995-06-20

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437944, 427516, 528125, 216 40, 216 13, H01L 2128

Patent

active

054260710

ABSTRACT:
A polyimide copolymer derived from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, oxydiphthalic dianhydride, m-phenylene diamine and 4,4'-oxydianiline, for use as a high-temperature resistant lift-off layer in the fabrication of integrated circuit substrates.

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