Polyimide-containing cover layer for a printed circuit element

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428200, 428520, 428901, 4273881, 427 93, B32B 300, B32B 2708

Patent

active

047465611

ABSTRACT:
A printed circuit element in which the outer conductor layers of the electrical components arranged on the outer conductor layers are provided with a cover layer. The cover layer includes a heat-sealable high-temperature adhesive joined to a layer of intractable fully aromatic polyimide.
The described circuit elements show very good mechanical, thermal and electrical properties and may be used advantageously inter alia in electronics, radio technology, computer technology, electric motors, aircraft and aerospace and telecommunications.

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